Call for Papers

Papers are invited in the following technical areas

  • Device Technologies: CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN, MEMS, reliability, characterization
  • Modeling and CAD: active/passive device modeling, CAD, EM simulation, co-simulation
  • Packaging Technology: MCM, SiP, TSV, flip chip assembly, wire bonding, anisotropic conductive film
  • Active Antennas and Passive ICs: on-chip antennas, integrated passive devices, ferrite, piezoelectric
  • Frequency Generation & Conversion ICs: VCOs, PLLs, synthesizers, frequency dividers/multipliers, mixers
  • Front-end RFICs: LNAs, VGAs, phase shifters, RF switches
  • Power ICs: power amplifiers, linearization circuits, drivers
  • Millimeter-wave and THz ICs: circuits operating at mm-wave and sub-mm-wavebands
  • Analog and Mixed Signal ICs: ADC, DAC, comparators, filters, AGC/VGA
  • High-Speed Data Transceivers: wireless/wireline/optical transceivers, CDRs for high-speed data links.
  • RF Sensor ICs: automotive radars, wearable devices, security, biomedical and healthcare applications
  • Power Transmission ICs: RFID, electromagnetic induction, wireless power transmission ICs
  • Emerging ICs: power management, digital RF circuits, RF BIST, reconfigurable ICs, vehicle electronic ICs